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1. general description the pr5331c3hn is a highly integrated transce iver module for contactless reader/writer communication at 13.56 mhz. a dedicated rom code is implemented to handle different rf protocols by an integrated microcontroller. the system host controller communicate s with the pr5331c3hn by using the usb or the hsu link. the protocol between the host controller and the pr5331c3hn, on top of this physical link is the ccid protocol. 1.1 rf protocols pr5331c3hn supports the pcd mode for felica (212 kbps and 424 kbps), iso/iec14443 type a and b (from 106 kbps to 847 kbps), mifare (106 kbps), b' cards (106 kbps), picopass tag (106 kbps) and innovision jewel cards (106 kbps) the initiator passive mode (from 106 kbps to 424 kbps) can be supported through the pc/sc transparent mode. 1.2 interfaces the pr5331c3hn supports usb 2.0 full speed interface (bus powered or host powered mode). pr5331c3hn has also a master i 2 c-bus interface enabling the drive of following peripherals: ? an external eeprom: in this case the pr5331c3hn is co nfigured as master and is able to communicate with external eeprom (address a0h) which can store configuration data like pid, uid and rf parameters ? a tda8029 contact smart card reader ? high speed uart (from 9600b up to 1.2 mb) 1.3 standards compliancy pr5331c3hn offers commands in order for ap plications to be compliant with ?emv contactless communication prot ocol specification v2.0.1?. pr5331c3hn supports rf protocols iso/iec 14443a and b such as compliancy with smart eid standard can be achieved at application level. support of usb 2.0 full speed, interoperable with usb 3.0 hubs pr5331c3hn contactless interface controller rev. 3.0 ? 3 august 2011 206430 product short data sheet public
pr5331c3hn_sds all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product short data sheet public rev. 3.0. ? 3 august 2011 206430 2 of 33 nxp semiconductors pr5331c3hn contactless interface controller the pr533c3hn in pcd mode is compliant wit h emv contactlesss specification v2.0.1. 1.4 supported operating systems ? microsoft windows 2000 ? microsoft windows xp (32 and 64 bits) ? microsoft windows 2003 server (32 and 64 bits) ? microsoft windows 2008 server (32 and 64 bits) ? microsoft windows vista (32 and 64 bits) ? microsoft windows 7 (32 and 64 bits) the pr533 is supported by the following os through the pcsc-lite driver: ? gnu/linux using libusb 1.0.x and later ? mac os leopard (1.5.6 and newer) ? mac os snow leopard (1.6.x) ? solaris ? freebsd 2. features and benefits ? usb 2.0 full speed host interface and ccid protocol support ? integrated microcontroller implements high-level rf protocols ? buffered output drivers to connect an antenna with minimum number of external components ? integrated rf level detector ? integrated data mode detector ? supports iso/iec 14443a reader/writer mode up to 848 kbit/s ? supports iso/iec 14443b reader/writer mode up to 848 kbit/s ? supports contactless communication according to the felica protocol at 212 kbit/s and 424 kbit/s ? supports mifare encryption ? typical operating distance in read/write mode for communication to iso/iec 14443a/mifare, iso/iec 14443b or felica cards up to 50 mm depending on antenna size and tuning ? i 2 c-bus master interface allows to connect an external i 2 c eeprom for configuration data storage or to control a tda8029 contact smart card reader ? low power modes ? hard power-down mode ? soft power-down mode ? only one external oscillator requ ired (27.12 mhz crystal oscillator) ? power modes ? usb bus power mode ? 2.5 v to 3.6 v power supply operating range in non usb bus power mode ? dedicated i/o ports for external device control
pr5331c3hn_sds all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product short data sheet public rev. 3.0. ? 3 august 2011 206430 3 of 33 nxp semiconductors pr5331c3hn contactless interface controller 3. quick reference data [1] v ddd , v dda and v dd(tvdd) must always be at the same supply voltage. 4. ordering information [1] 70 refers to the rom code vers ion described in the user manual. [2] refer to section 14.4 ? licenses ? . [3] msl 2 (moisture sensitivity level). table 1. quick reference data symbol parameter conditions min typ max unit v bus bus supply voltage 4.02 5 5.25 v (non usb mode); v bus =v ddd; v ssd =0v 2.5 3.3 3.6 v v dda analog supply voltage v dda = v ddd = v dd(tvdd) = v dd(pvdd) ; v ssa = v ssd = v ss(pvss) = v ss(tvss) = 0 v [1] 2.5 3.3 3.6 v v ddd digital supply voltage [1] 2.5 3.3 3.6 v v dd(tvdd) tvdd supply voltage [1] 2.5 3.3 3.6 v v dd(pvdd) pvdd supply voltage 1.6 - 3.6 v v dd(svdd) svdd supply voltage v ssa = v ssd = v ss(pvss) = v ss(tvss) = 0 v; reserved for future use v ddd ?? 0.1 - v ddd v i bus bus supply current maximum load current (usb mode); measured on v bus 150 ma maximum inrush current limitation; at power-up (curlimoff = 0) 100 ma i pd power-down current v dda = v ddd = v dd(tvdd) = v dd(pvdd) = 3 v; not powered from usb hard power-down; rf level detector off 10 ? a soft power-down; rf level detector on 30 ? a i ccsl suspended low-power device supply current rf level detector on, (without resistor on dp/dm) --250 ? a i ddd digital supply current rf level detector on, v dd(svdd) switch off [1] -15-ma i dd(svdd) svdd supply current v dds = 3 v - - 30 ma i dda analog supply current rf level detector on - 6 - ma i dd(tvdd) tvdd supply current during rf transmission; v dd(tvdd) =3 v -60100ma p tot total power dissipation t amb = ? 30 to +85 ? c--0 . 5 5w t amb ambient temperature ? 30 - +85 ? c table 2. ordering information type number package name description version pr5331c3hn/c350 [1] [2] [3] hvqfn40 plastic thermal enhanced very thin quad flat package; no leads; 40 terminals; body 6 x 6 x 0.85 mm sot618-1
pr5331c3hn_sds all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product short data sheet public rev. 3.0. ? 3 august 2011 206430 4 of 33 nxp semiconductors pr5331c3hn contactless interface controller 5. block diagram the following block diagram describes hardware blocks controlled by pr5331c3hn firmware or which can be accessible for data transaction by a host baseband. fig 1. block diagram aaa-000043 supply supervisor 27 mhz osc and frac n pll svdd switch nfc analog front end and cluart 80c51 cpu 44 k rom 1.2 k bytes ram usb device i 2 c master matx rstpd_n pvdd svdd vbus p30 p31 p32_int0 gpios p33_int0 p35 rstout_n dvdd p70_irq avss dvss oscin oscout i0 i1 sda p50_scl delatt 48 mhz sigin sigout p34 tvdd avdd rx vmid tx1 tvss tx2 regulator 3.3 v pcr
pr5331c3hn_sds all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product short data sheet public rev. 3.0. ? 3 august 2011 206430 5 of 33 nxp semiconductors pr5331c3hn contactless interface controller 6. pinning information 6.1 pinning 6.2 pin description fig 2. pin configuration for hvqfn 40 (sot618-1) aaa-000044 pr533 p70_irq vmid rx rstout_n avdd dvss tvss2 dm tx2 dp tvdd pvdd tx1 delatt tvss1 p30 loadmod p31 dvss p32_int0 avss aux1 aux2 dvss oscin oscout i0 i1 testen p35 vbus dvdd rstpd_n svdd sigin sigout p34 sda p50_scl p33_int1 10 21 9 22 8 23 7 24 6 25 5 26 4 27 3 28 2 29 1 30 11 12 13 14 15 16 17 18 19 20 40 39 38 37 36 35 34 33 32 31 terminal 1 index area transparent top view table 3. pr533 pin description symbol pin type pad ref voltage description dvss 1 g digital ground loadmod 2 o dvdd load modulation output provides digital signal for felica and mifare card operating mode tvss1 3 g transmitter ground: suppli es the output stage of tx1 tx1 4 o tvdd transmitter 1: transmits modulated 13.56 mhz energy carrier tvdd 5 p transmitter power supply: supplies the output stage of tx1 and tx2 tx2 6 o tvdd transmitter 2: delivers t he modulated 13.56 mhz energy carrier tvss2 7 g transmitter ground: suppli es the output stage of tx2 avdd 8 p analog power supply vmid 9 p avdd internal reference voltage: this pin delivers the internal reference voltage. rx 10 i avdd receiver input: input pin for the re ception signal, which is the load modulated 13.56 mhz energy carrier from the antenna circuit avss 11 g analog ground aux1 12 o dvdd auxiliary output 1: this pi n delivers analog and digital test signals aux2 13 o dvdd auxiliary output 2: this pi n delivers analog and digital test signals dvss 14 g digital ground
pr5331c3hn_sds all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product short data sheet public rev. 3.0. ? 3 august 2011 206430 6 of 33 nxp semiconductors pr5331c3hn contactless interface controller oscin 15 i avdd crystal oscillator in put: input to the inverting amplif ier of the oscillator. this pin is also the input for an externally generated clock (f clk = 27.12 mhz). oscout 16 o avdd crystal oscillator output: output of the inverting amplifier of the oscillator. i0 17 i dvdd interface mode lines: selects the used host interface; in test mode i0 is used as test signals. i1 18 i dvdd testen 19 i dvdd test enable pin: when set to 1 enable the test mode. when set to 0 reset the tcb and disable the access to the test mode. p35 20 i/o dvdd general purpose i/o signal p70_irq 21 i/o pvdd interrupt request: output to signal an interrupt event to the host (port 7 bit 0) rstout_n 22 o pvdd output reset signal; when low it indicates that the circuit is in reset state. dvss 23 g digital ground dm 24 i/o pvdd usb d ? data line in usb mode or tx in hsu mode; in test mode this signal is used as input and output test signal dp 25 i/o pvdd usb d+ data line in usb mode or rx in hsu mode; in test mode this signal is used as input and output test signal. pvdd 26 p i/o pad power supply delatt 27 o pvdd optional output for an external 1.5 k ? resistor connection on d+. p30 28 i/o pvdd general purpose i/o signal. can be configured to act either as rx line of the second serial interface uart or general purpose i/o. in test mode this signal is used as input and output test signal. p31 29 i/o pvdd general purpose i/o signal. can be configured to act either as tx line of the second serial interface uart or general purpose i/o. in test mode this signal is used as input and output test signal. p32_int0 30 i/o pvdd general purpose i/o signal. can also be used as an interrupt source in test mode this signal is used as input and output test signal. p33_int1 31 i/o pvdd general purpose i/o signal. can be used to generate an hz state on the output of the selected inte rface for the host communic ation and to enter into power-down mode without resetting the internal state of pr533. in test mode this signal is used as input and output test signal. p50_scl 32 i/o dvdd i 2 c-bus clock line - open-drain in output mode sda 33 i/o dvdd i 2 c-bus data line - open-drain in output mode p34 34 i/o svdd general purpose i/o signal or clock signal for the sam sigout 35 o svdd contactless commun ication interface output: deliv ers a serial data stream according to nfcip-1 and output signal for the sam. in test mode this signal is used as test signal output. sigin 36 i svdd contactless communication interface input: accepts a digital, serial data stream according to nfcip-1 and input signal from the sam. in test mode this signal is used as test signal input. svdd 37 p output power for sam power supply. switched on by firmware with an overload detection. used as a refer ence voltage for sam communication. table 3. pr533 pin description ?continued symbol pin type pad ref voltage description
pr5331c3hn_sds all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product short data sheet public rev. 3.0. ? 3 august 2011 206430 7 of 33 nxp semiconductors pr5331c3hn contactless interface controller [1] pin types: i= input, o = output, i/o = input/output, p = power and g = ground. 7. limiting values [1] 1500 ? , 100 pf; eia/jesd22-a114-a [2] 0.75 mh, 200 pf; eia/jesd22-a115-a [3] field induced model; eia/jesc22-c101-c 8. recommended operating conditions rstpd_n 38 i pvdd reset and power-down: when low, internal current sources are switched off, the oscillator is inhibited, and the input pads are disconnected from the outside world. with a negative edge on this pin the internal reset phase starts. dvdd 39 p digital power supply vbus 40 p usb power supply. table 3. pr533 pin description ?continued symbol pin type pad ref voltage description table 4. limiting values in accordance with the absolute maximum rating system (iec 60134). symbol parameter conditions min max unit v dda analog supply voltage ? 0.5 +4 v v ddd digital supply voltage ? 0.5 +4 v v dd(tvdd) tvdd supply voltage ? 0.5 +4 v v dd(pvdd) pvdd supply voltage ? 0.5 +4 v v dd(svdd) svdd supply voltage ? 0.5 +4 v v bus bus supply voltage ? 0.5 +5.5 v p tot total power dissipation - 500 mw i dd(svdd) svdd supply current maximum current in v dds switch -30ma v i input voltage tx1, tx2, rx pins ? 0.5 +4 v v esd electrostatic discharge voltage hbm [1] ? 2.0 kv mm [2] -200v cdm [3] - ? 1kv t stg storage temperature ? 55 +150 ?c t j junction temperature ? 40 +125 ?c table 5. operating conditions symbol parameter conditions min typ max unit v bus bus supply voltage v ssa = v ssd = v ss(pvss) = v ss(tvss) = 0 v 4.02 5 5.25 v supply voltage (non usb mode); v bus = v ddd ; v ssa = v ssd = v ss(pvss) = v ss(tvss) = 0 v 2.5 3.3 3.6 v v dda analog supply voltage v dda = v ddd = v dd(tvdd) = v dd(pvdd) ; v ssa = v ssd = v ss(pvss) = v ss(tvss) = 0 v [1] [2] 2.5 3.3 3.6 v
pr5331c3hn_sds all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product short data sheet public rev. 3.0. ? 3 august 2011 206430 8 of 33 nxp semiconductors pr5331c3hn contactless interface controller [1] v ssa , v ddd and v dd(tvdd) shall always be on the same voltage level. [2] supply voltages below 3 v reduces the perform ance (e.g. the achievable operating distance). 9. thermal characteristics v ddd digital supply voltage v dda = v ddd = v dd(tvdd) = v dd(pvdd) ; v ssa = v ssd = v ss(pvss) = v ss(tvss) = 0 v [1] [2] 2.5 3.3 3.6 v v dd(tvdd) tvdd supply voltage v dda = v ddd = v dd(tvdd) = v dd(pvdd) ; v ssa = v ssd = v ss(pvss) = v ss(tvss) = 0 v [1] [2] 2.5 3.3 3.6 v v dd(pvdd) pvdd supply voltage supply pad for host interface; v dda = v ddd = v dd(tvdd) = v dd(pvdd) ; v ssa = v ssd = v ss(pvss) = v ss(tvss) = 0 v [2] 1.6 1.8 to 3.3 3.6 v t amb ambient temperature ? 30 +25 +85 ?c table 5. operating conditions ?continued symbol parameter conditions min typ max unit table 6. thermal characteristics symbol parameter conditions min typ max unit r th(j-a) thermal resistance from junction to ambient in free air with exposed pad soldered on a 4 layer jedec pcb-0.5 -3741.1k/w
pr5331c3hn_sds all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product short data sheet public rev. 3.0. ? 3 august 2011 206430 9 of 33 nxp semiconductors pr5331c3hn contactless interface controller 10. characteristics unless otherwise specified, the limits are given for the full operating conditions. the typical value is given for 25 ? c, v ddd = 3.4 v and v dd(pvdd) = 3 v in non-usb bus power mode, v bus = 5 v in usb power mode. timings are only given from characterization results. 10.1 power manageme nt characteristics 10.1.1 current consumption characteristics typical value using a complementary driver configuration and an antenna matched to 40 ? between tx1 and tx2 at 13.56 mhz. [1] i pd is the total currents over all supplies. [2] i dd(pvdd) depends on the overall load at the digital pins. [3] i dd(svdd) depends on the overall load on v dd(svdd) pad. [4] i dd(tvdd) depends on v dd(tvdd) and the external circuitry connected to tx1 and tx2. [5] during operation with a typical circui try the overall current is below 100 ma. 10.1.2 voltage regulator characteristics table 7. current consumption characteristics symbol parameter conditions min typ max unit i pd power-down current v dda = v ddd = v dd(tvdd) = v dd(pvdd) = 3 v; not powered from usb hard power-down current; not powered from usb; rf level detector off [1] -1.310 ? a soft power-down current; not powered from usb; rf level detector on [1] -930 ? a i ccsl suspended low-power device supply current v bus =5v; v dda = v ddd = v dd(tvdd) = v dd(pvdd) =3v; v dds = 0 v; rf level detector on (without resistor on pin dp (d+)) [1] - 120 250 ? a i ddd digital supply current v dda = v ddd = v dd(tvdd) = v dd(pvdd) = 3 v; rf level detector on -12- ma i dda analog supply current v dda = v ddd = v dd(tvdd) = v dd(pvdd) =3v; rf level detector on - 3 6 ma rf level detector off - 1.5 5 ma i dd(pvdd) pvdd supply current [2] --30ma i dd(svdd) svdd supply current sam_switch_en set to 1 [3] --30ma i dd(tvdd) tvdd supply current continuous wave; v dd(tvdd) =3v [4] [5] - 60 100 ma table 8. voltage regulator characteristics [1] symbol parameter conditions min typ max unit v bus bus supply voltage usb mode; v ss = 0 v 4.02 5 5.25 v v ddd digital supply voltage after inrush current limitation (usb mode); from i vddd = 0 ma to i vddd =150ma 2.95 3.3 3.6 v i bus bus supply current usb mode; measure on v bus --150ma
pr5331c3hn_sds all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product short data sheet public rev. 3.0. ? 3 august 2011 206430 10 of 33 nxp semiconductors pr5331c3hn contactless interface controller [1] the internal regulator is only enabled when the usb interface is selected by i0 and i1. 10.2 antenna presence se lf test thresholds the values in ta b l e 9 are guaranteed by design. only functional is done in production for cases andet_ithl[1:0]=10b an d for andet_ithh[2:0]=011b. i inrush(lim) inrush current limit at power-up (curlimofff = 0) - - 100 ma v th(rst)reg regulator reset threshold voltage regulator reset 1.90 2.15 2.40 v v th(rst)reg(hys) regulator reset threshold voltage hysteresis 35 60 85 mv v ddd decoupling capacitor 8 10 - ? f table 8. voltage regulator characteristics [1] ?continued symbol parameter conditions min typ max unit table 9. antenna presence detection parameter conditions min typ max unit i vddd lower current threshold for antenna presence detection andet_ithl[1:0] 00b - 5 - ma 01b - 15 - ma 10b - 25 - ma 11b - 35 - ma i vddd upper current threshold for antenna presence detection andet_ithh[2:0] 000b - 45 - ma 001b - 60 - ma 010b - 75 - ma 011b - 90 - ma 100b - 105 - ma 101b - 120 - ma 110b - 135 - ma 111b - 150 - ma
pr5331c3hn_sds all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product short data sheet public rev. 3.0. ? 3 august 2011 206430 11 of 33 nxp semiconductors pr5331c3hn contactless interface controller 10.3 typical 27.12 mhz crystal requirements 10.4 pin characteristics for 27.12 mhz xtal oscillator (oscin, oscout) [1] ? n(th) and f ? n(th) define the mask for maximum accept able phase noise of the cl ock signal at the oscin, oscout inputs. see figure 3 ? 27.12 mhz input clock phase noise spectrum mask ? . table 10. crystal requirements symbol parameter conditions min typ max unit f xtal crystal frequency 27.107 27.12 27.133 mhz esr equivalent series resistance - - 100 ? c l load capacitance - 10 - pf p xtal crystal power dissipation 100 - - ? w table 11. pin characteristics for 27.12 mhz xtal oscillator (oscin, oscout) symbol parameter conditions min typ max unit i li input leakage current rstpd_n = 0 v ? 1-+1ma v ih high-level input voltage 0.7 ? v dda -v dda v v il low-level input voltage 0 - 0.3 ? v dda v v oh high-level output voltage - 1.1 - v v ol low-level output voltage - 0.2 - v f clk clock frequency ? 0.05 % 27.12 +0.05 % mhz ? duty cycle 40 50 60 % ? n(th) phase noise threshold [1] -- ? 140 dbc/hz f ? n(th) phase noise threshold frequency ? n(th) = ? 140dbc/hz; ? 20db/decade slope [1] - - 50 khz oscin v i input voltage dc - 0.65 - v c i input capacitance v dda = 2.8 v; v i (dc) = 0.65 v; v i (ac) = 1 v p-p -2-p f oscout c i input capacitance - 2 - pf fig 3. 27.12 mhz input clock phase noise spectrum mask n(th) phase noise (dbc/hz) -20 db/decade acceptable phase noise area 001aao393 f n(th) frequency (hz)
pr5331c3hn_sds all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product short data sheet public rev. 3.0. ? 3 august 2011 206430 12 of 33 nxp semiconductors pr5331c3hn contactless interface controller 10.5 rstpd_n input pin characteristics 10.6 input pin characteristi cs for i0, i1 and testen [1] to minimize power consumption when in soft power-down mode, the limit is v ddd ? 0.4 v. [2] to minimize power consumption when in soft power-down mode, the limit is 0.4 v. [3] testen should never be set to high level in the applic ation. it is used for production test purpose only. it is recommended to connect testen to ground although there is a pull-down included. table 12. rstpd_n input pin characteristics symbol parameter conditions min typ max unit v ih high-level input voltage v dd(pvdd) ? 0.4 - v dd(pvdd) v v il low-level input voltage 0-0.4v i ih high-level input current v i =v dd(pvdd) ? 1-1 ? a i il low-level input current v i = 0 v ? 1-1 ? a c i input capacitance - 2.5 - pf table 13. input pin characteristics for i0, i1 and testen symbol parameter conditions min typ max unit v ih high-level input voltage [1] 0.7 ? v ddd -v ddd v v il low-level input voltage [2] 00 . 3 ? v ddd v i ih high-level input current i0 and i1; v i =v ddd [3] ? 1-1 ? a i il low-level input current v i =0v ? 1-1 ? a c i input capacitance - 2.5 - pf
pr5331c3hn_sds all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product short data sheet public rev. 3.0. ? 3 august 2011 206430 13 of 33 nxp semiconductors pr5331c3hn contactless interface controller 10.7 rstout_n output pin characteristics [1] data at v dd(pvdd) = 1.8v are only given from characterization results. [2] i oh and i ol give the output drive capability from which the rise and fall times may be calculated as a function of the load capacitance. table 14. rstout_n output pin characteristics symbol parameter conditions min typ max unit v oh high-level output voltage v dd(pvdd) =3v; i oh = ? 4ma 0.7 ? v dd(pvdd) -v dd(pvdd) v v dd(pvdd) =1.8v; i oh = ? 2ma [1] 0.7 ? v dd(pvdd) -v dd(pvdd) v v ol low-level output voltage v dd(pvdd) =3v; i ol =4ma 0 - 0.3 ? v dd(pvdd) v v dd(pvdd) =1.8v; i ol =2ma [1] 0-0 . 3 ? v dd(pvdd) v i oh high-level output current v dd(pvdd) =3v; v oh = 0.8 ? v dd(pvdd) [2] ? 4-- ma v dd(pvdd) =1.8v; v oh = 0.7 ? v dd(pvdd) ? 2-- ma i ol low-level output current v dd(pvdd) =3v; v ol = 0.2 ? v dd(pvdd) [2] 4--m a v dd(pvdd) =1.8v; v ol = 0.3 ? v dd(pvdd) 2--m a c l load capacitance - 30 pf t r rise time v dd(pvdd) =3v; v oh =0.8 ? v dd(pvdd) ; c l =30pf --13.5ns v ddp =1.8v; v oh =0.7 ? v dd(pvdd) ; c l =30pf --1 0 . 8n s t f fall time v dd(pvdd) =3v; v ol =0.2 ? v dd(pvdd) ; c l =30pf --13.5ns v dd(pvdd) =1.8v; v ol =0.3 ? v dd(pvdd) ; c l =30pf --1 0 . 8n s
pr5331c3hn_sds all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product short data sheet public rev. 3.0. ? 3 august 2011 206430 14 of 33 nxp semiconductors pr5331c3hn contactless interface controller 10.8 input/output characte ristics for pin p70_irq [1] to minimize power consumption when in soft power-down mode, the limit is v dd(pvdd) ? 0.4 v. [2] to minimize power consumption when in soft power-down mode, the limit is 0.4 v. [3] data at v dd(pvdd) = 1.8 v are only given from characterization results. [4] the i oh and i ol give the output driving capabi lity and allow to calculate directly the rise and fall time as function of the load capacitance. table 15. input/output pin ch aracteristics for pin p70_irq symbol parameter conditions min typ max unit v ih high-level input voltage [1] 0.7 ? v dd(pvdd) -v dd(pvdd) v v il low-level input voltage [2] 0- 0 . 3 ? v dd(pvdd) v v oh high-level output voltage push-pull mode; v dd(pvdd) =3v; i oh = ? 4ma 0.7 ? v dd(pvdd) -v dd(pvdd) v push-pull mode; v dd(pvdd) = 1.8 v; i oh =-2ma [3] 0.7 ? v dd(pvdd) -v dd(pvdd) v v ol low-level output voltage push-pull mode; v dd(pvdd) =3v; i ol =4ma 0-0.3 ? v dd(pvdd) v push-pull mode; v dd(pvdd) = 1.8 v; i ol =2ma [3] 0- 0 . 3 ? v dd(pvdd) v i ih high-level input current input mode; v i =v ddd ? 1-1 ? a i il low-level input current input mode; v i =0v ? 1-1 ? a i oh high-level output current v dd(pvdd) =3v; v oh =0.8 ? v dd(pvdd) [5] ? 4-- ma i ol low-level output current v dd(pvdd) =3v; v ol =0.2 ? v dd(pvdd) [5] 4- -m a i li input leakage current rstpd_n = 0.4 v ? 1-1 ? a c i input capacitance - 2.5 pf c l load capacitance - - 30 pf t r rise time v dd(pvdd) =3v; v oh =0.8 ? v dd(pvdd) ; c l =30pf --13.5ns v dd(pvdd) =1.8v; v oh =0.7 ? v dd(pvdd) ; c l =30pf --10.8ns t f fall time v dd(pvdd) =3v; v ol =0.2 ? v dd(pvdd) ; c l =30pf --13.5ns v dd(pvdd) =1.8v; v ol =0.3 ? v dd(pvdd) ; c l =30pf --10.8ns
pr5331c3hn_sds all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product short data sheet public rev. 3.0. ? 3 august 2011 206430 15 of 33 nxp semiconductors pr5331c3hn contactless interface controller 10.9 input/output pin char acteristics for p30 / uar t_rx, p31 / uart_tx, p32_int0, p33_int1 [1] to minimize power consumption when in soft power-down mode, the limit is v dd(pvdd) ? 0.4 v. [2] to minimize power consumption when in soft power-down mode, the limit is 0.4 v [3] data at v dd(pvdd) = 1.8 v are only given from characterization results. [4] the i oh and i ol give the output driving capabi lity and allow to calculate directly the rise and fall time as function of the load capacitance. table 16. input/output pi n characteristics for p30 / uart_rx, p31 / uart_tx, p32_int0, p33_int1 symbol parameter conditions min typ max unit v ih high-level input voltage [1] 0.7 ? v dd(pvdd) -v dd(pvdd) v v il low-level input voltage [2] 0-0 . 3 ? v dd(pvdd) v v oh high-level output voltage push-pull mode; v dd(pvdd) =3v; i oh = ? 4ma v dd(pvdd) ? 0.4 - v dd(pvdd) v v dd(pvdd) =1.8v; i oh = ? 2ma [3] v dd(pvdd) ? 0.4 - v dd(pvdd) v v ol low-level output voltage push-pull mode; v dd(pvdd) =3v; i ol =4ma 0-0.4v v dd(pvdd) =1.8v; i ol =2ma [3] 0-0 . 4v i ih high-level input current input mode; v i =v dd(pvdd) ? 1-1 ? a i il low-level input current input mode; v i =0v ? 1-1 ? a i oh high-level output current v dd(pvdd) =3v; v oh =0.8 ? v dd(pvdd) [4] ? 4-- ma i ol low-level output current v dd(pvdd) =3v; v ol =0.2 ? v dd(pvdd) [4] 4-- m a i li input leakage current rstpd_n = 0.4 v ? 1-1 ? a c i input capacitance - 2.5 - pf c l load capacitance - - 30 pf t r rise time v dd(pvdd) =3v; v oh =0.8 ? v dd(pvdd) ; c l =30pf --13.5ns v dd(pvdd) =1.8v; v oh =0.7 ? v dd(pvdd) ; c l =30pf --10.8ns t f fall time v dd(pvdd) =3v; v ol =0.2 ? v dd(pvdd) ; c l =30pf --13.5ns v dd(pvdd) =1.8v; v ol =0.3 ? v dd(pvdd) ; c l =30pf --10.8ns
pr5331c3hn_sds all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product short data sheet public rev. 3.0. ? 3 august 2011 206430 16 of 33 nxp semiconductors pr5331c3hn contactless interface controller 10.10 input/output pin ch aracteristics for p35 [1] to minimize power consumption when in soft power-down mode, the limit is v ddd ? 0.4 v. [2] to minimize power consumption when in soft power-down mode, the limit is 0.4 v. [3] the i oh and i ol give the output driving capabi lity and allow to calculate directly the rise and fall time as function of the load capacitance. table 17. input/output pin characteristics for p35 symbol parameter conditions min typ max unit v ih high-level input voltage [1] 0.7 ? v ddd -v ddd v v il low-level input voltage [2] 0-0 . 3 ? v ddd v v oh high-level output voltage v ddd =3v; i oh = ? 4ma v ddd ? 0.4 - v ddd v v ol low-level output voltage v ddd =3v; i ol =4ma 0 - 0.4 v i ih high-level input current v i =v ddd ? 1-1 ? a i il low-level input current v i =0v ? 1-1 ? a i oh high-level output current v ddd =3v; v oh =0.8 ? v dd(pvdd) [3] ? 4-- ma i ol low-level output current v ddd =3v; v ol =0.2 ? v dd(pvdd) [3] 4-- m a i li input leakage current rstpd_n = 0.4 v ? 1-1 ? a c i input capacitance - 2.5 - pf c l load capacitance - - 30 pf t r rise time v ddd =3v; v oh =0.8 ? v ddd ; c l =30pf --13.5ns v ddd =1.8v; v oh =0.7 ? v ddd ; c l =30pf --10.8ns t f fall time v ddd =3v; v ol =0.2 ? v ddd ; c l =30pf --13.5ns v ddd =1.8v; v ol =0.3 ? v ddd ; c l =30pf --10.8ns
pr5331c3hn_sds all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product short data sheet public rev. 3.0. ? 3 august 2011 206430 17 of 33 nxp semiconductors pr5331c3hn contactless interface controller 10.11 input/output pi n characteristics for dp and dm [1] the value does not guarantee the power-down consumptions. to r each the specified power-down cons umptions, the limit is 0.4 v . [2] the i oh and i ol give the output driving capabi lity and allow to calculate directly the rise and fall time as function of the load capacitance. table 18. input/output pin characterist ics for dp and dm for usb interface symbol parameter conditions min typ max unit v ih high-level input voltage v dd(pvdd) =3.3v 2 - 3.6 v v il low-level input voltage [1] 0- 0.8v v oh high-level output voltage v dd(pvdd) =3.3v; r pd =1.5 ? to v ss 2.8 - v dd(pvdd) v v ol low-level output voltage v dd(pvdd) =3.3v; r pd =1.5 ? to v dd(pvdd) 0- 0.3v i oh high-level output current v dd(pvdd) =3.3v; v oh =0.8 ? v dd(pvdd) [2] ? 4- - ma v dd(pvdd) =1.8v; v oh =0.7 ? v dd(pvdd) ? 2- - ma i ol low-level output current v dd(pvdd) =3.3v; v ol =0.2 ? v dd(pvdd) [2] 4- - ma v dd(pvdd) =1.8v; v ol =0.3 ? v dd(pvdd) 2- - ma i ih high-level input current v i =v dd(pvdd) --1 ? a i il low-level input current v i =0v --1 ? a i li input leakage current rstpd_n = 0 v ? 1- +1 ? a c i input capacitance - 2.5 3.5 pf z inp input impedance exclusive of pull-up/pull-down (for low-/full speed) 300 - - k ? z drv driver output impedance for driver which is not high-speed capable 28 - 44 ? t fdrate full-speed data rate for devices which are not high-speed capable 11.97 - 12.03 mb/s t dj1 source jitter total (including frequency tolerance) to next transition ? 3.5 - +3.5 ns t dj2 source jitter total (including frequency tolerance) for paired transitions ? 4- +4ns t fdeop source jitter for differential transition to se0 transition ? 2- +5ns t jr1 receiver jitter to next transition ? 18.5 - +18.5 ns t jr2 receiver jitter for paired transitions ? 9- +9ns t feopt source se0 interval of eop 160 - 175 ns t feopr receiver se0 interval of eop 82 - - ns t fst width of se0 interval during differential transition --14ns
pr5331c3hn_sds all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product short data sheet public rev. 3.0. ? 3 august 2011 206430 18 of 33 nxp semiconductors pr5331c3hn contactless interface controller table 19. usb dp/dm differential receiver input levels symbol parameter conditions min typ max unit v di differential input sensitivity voltage - 0.2--v v cm differential common mode voltage range - 0.8 - 2.5 v table 20. usb dp/dm driver characteristics symbol parameter conditions min typ max unit t r rise time c l = 50 pf; 10 % to 90 % of (v oh - v ol ) 4- 20ns t f fall time c l = 50 pf; 10 % to 90 % of (v oh - v ol ) 4- 20ns t frfm differential rise and fall time matching (t fr /t ff ); excluding the first transition from idle state 90 - 111.1 % v crs output signal crossover voltage excluding the first transition from idle state 1.3 - 2.0 v fig 4. transmit waveform at dp/dm 001aan914 level 1 level 2 -400 mv differential +400 mv differential 0 v differential unit interval 100 % 0 % point 5 point 6 point 3 point 4 point 1 point 2
pr5331c3hn_sds all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product short data sheet public rev. 3.0. ? 3 august 2011 206430 19 of 33 nxp semiconductors pr5331c3hn contactless interface controller [1] the value does not guarantee the power-down consumptions. to reach the specified power-down consumptions, the limit is v dd(pvdd) ? 0.4 v. [2] the value does not guarantee the power-down consumptions. to r each the specified power-down cons umptions, the limit is 0.4 v . [1] the i oh and i ol give the output driving capability and allo w to calculate directly the rise and fall time as function of the load capacitance table 21. input pin characteristics for dp for hsu interface symbol parameter conditions min typ max unit v ih high-level input voltage [1] 0.7 ? v dd(pvdd) -v dd(pvdd) v v il low-level input voltage [2] 0-0 . 3 ? v dd(pvdd) v i ih high-level input current v i = v dd(pvdd) --1m a i il low-level input current v i = 0 v - - 1 ma i li input leakage current rstpd_n = 0 v ? 11ma c i input capacitance - 2.5 3.5 pf table 22. output pin characteristi cs for dm for hsu interface symbol parameter conditions min typ max unit v oh high-level output voltage v dd(pvdd) =3v; i oh = ? 4 ma v dd(pvdd) ? 0.4 - v dd(pvdd) v v dd(pvdd) =1.8v; i oh = ? 2 ma v dd(pvdd) ? 0.4 - v dd(pvdd) v v ol low-level output voltage v dd(pvdd) =3v; i ol = ? 4 ma 0 - 0.4 v v dd(pvdd) =1.8v; i ol = ? 2 ma 0 - 0.4 v i oh high-level output current v dd(pvdd) =3v; v oh =0.8 ? v dd(pvdd) [1] ? 4--ma v dd(pvdd) =1.8v; v oh =0.7 ? v dd(pvdd) ? 2--ma i ol low-level output current v dd(pvdd) =3.3v; v ol =0.2 ? v dd(pvdd) [1] 4--m a v dd(pvdd) =1.8v; v ol =0.3 ? v dd(pvdd) 2--m a i li input leakage current rstpd_n = 0 v ? 1-1ma c l load capacitance - - 30 pf t r rise time v ddp =3v; v oh =0.8 ? v dd(pvdd) ; c l =30pf - - 13.5 ns v dd(pvdd) =1.8v; v oh =0.7 ? v dd(pvdd) ; c l =30pf - - 10.8 ns t f fall time v dd(pvdd) =3v; v ol =0.2 ? v dd(pvdd) ; c l =30pf - - 13.5 ns v ddp =1.8v; v ol =0.3 ? v dd(pvdd) ; c l =30pf - - 10.8 ns
pr5331c3hn_sds all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product short data sheet public rev. 3.0. ? 3 august 2011 206430 20 of 33 nxp semiconductors pr5331c3hn contactless interface controller 10.12 input pin character istics for sda/p50_slc [1] to minimize power consumption when in soft power-down mode, the limit is v ddd ? 0.4 v. [2] to minimize power consumption when in soft power-down mode, the limit is 0.4 v. [3] the pr533 has a slope control according to the i 2 c-bus specification for the fast mode. the slope control is always present and not dependent of the i 2 c-bus speed. 10.13 output pin char acteristics for delatt [1] to minimize power consumption when in soft power-down mode, the limit is v dd(pvdd) ? 0.4 v. 10.14 input pin charact eristics for sigin [1] to minimize power consumption when in soft power-down mode, the limit is v dd(svdd) ? 0.4 v. [2] to minimize power consumption when in soft power-down mode, the limit is 0.4 v. table 23. input/output drain output pi n characteristics for sda/p50_slc i 2 c interface symbol parameter conditions min typ max unit v ih high-level input voltage [1] 0.7 ? v dd(pvdd) -v ddd v v il low-level input voltage [2] 0-0 . 3 ? v ddd v v ol low-level output voltage v ddd =3v; i ol = ? 4ma 0-0.3v i ih high-level input current v i =v ddd ? 1-1 ? a i il low-level input current v i =0v ? 1-1 ? a i li input leakage current rstpd_n = 0.4 v ? 1-1 ? a c i input capacitance - 2.5 pf c l load capacitance - - 30 pf t r rise time of both sda and scl signals [3] 20 - 300 ns t f fall time of both sda and scl signals [3] 20 - 300 ns table 24. output pin char acteristics for delatt symbol parameter conditions min typ max unit v oh high-level output voltage [1] 0.7 ? v dd(svdd) -v dd(svdd) v v il low-level input voltage 0 - 0.3 ? v dd(pvdd) v i ih high-level input current input mode; v i =v dd(svdd) ? 1-1 ? a i il low-level input current input mode; v i =0v ? 1-1 ? a i li input leakage current rstpd_n = 0.4 v ? 1-1 ? a c i input capacitance - 2.5 - pf table 25. input/output pin characteristics for sigin symbol parameter conditions min typ max unit v ih high-level input voltage [1] 0.7 ? v dd(svdd) -v dd(svdd) v v il low-level input voltage [2] 0-0 . 3 ? v dd(svdd) v i ih high-level input current v i =v dd(svdd) ? 1-+1 ? a i il low-level input current v i =0v ? 1-+1 ? a i li input leakage current rstpd_n = 0.4 v ? 1-+1 ? a c i input capacitance - 2.5 - pf
pr5331c3hn_sds all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product short data sheet public rev. 3.0. ? 3 august 2011 206430 21 of 33 nxp semiconductors pr5331c3hn contactless interface controller 10.15 output pin char acteristics for sigout table 26. output pin char acteristics for sigout symbol parameter conditions min typ max unit v oh high-level output voltage v ddd ? 0.1 < v dd(svdd) pr5331c3hn_sds all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product short data sheet public rev. 3.0. ? 3 august 2011 206430 22 of 33 nxp semiconductors pr5331c3hn contactless interface controller 10.16 input/output pin ch aracteristics for p34 [1] to minimize power consumption when in soft power-down mode, the limit is v dd(svdd) ? 0.4 v. [2] to minimize power consumption when in soft power-down mode, the limit is 0.4 v. [3] i oh and i ol specify the output drive capabi lity from which the rise and fall times may be calculated as a function of the load capacitance . 10.17 output pin charact eristics for loadmod table 27. input/output pin characteristics for p34 symbol parameter conditions min typ max unit v ih high-level input voltage [1] 0.7 ? v dd(svdd) -v dd(svdd) v v il low-level input voltage [2] 0-0 . 3 ? v dd(svdd) v v oh high-level output voltage push-pull; v ddd ? 0.1 < v dd(svdd) pr5331c3hn_sds all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product short data sheet public rev. 3.0. ? 3 august 2011 206430 23 of 33 nxp semiconductors pr5331c3hn contactless interface controller 10.18 input pin characteristics for rx [1] the minimum modulation voltage is valid for al l modulation schemes except miller coded signals. 10.19 output pin charact eristics for aux1/aux2 table 29. input pin characteristics for rx symbol parameter conditions min typ max unit v i input voltage dynamic; signal frequency at 13.56 mhz ? 0.7 v dda +1 v c i input capacitance 6 10 14 pf r s series resistance rx input; v dda =3v; receiver active; v rx(p-p) =1v; 1.5 v dc offset 315 350 385 ? minimum dynamic input voltage v rx(p-p) peak-to-peak receiver voltage miller coded; 106 kbit/s -150500mv manchester coded; 212 kbit/s and 424 kbit/s -100200mv maximum dynamic input voltage v rx(p-p) peak-to-peak receiver voltage miller coded; 106 kbit/s v dda -- v manchester coded; 212 and 424 kbit/s v dda -- v minimum modulation voltage v mod modulation voltage rxgain = 6 and 7 [1] --6mv rxgain = 4 and 5 [1] --18mv rxgain = 0 to 3 [1] --120mv minimum modulation index m modulation index miller coded; 106 kbit/s v rx(p-p) =1.5v; sensmiller = 3 -33-% table 30. output pin characteristics for aux1/aux2 symbol parameter conditions min typ max unit v oh high-level output voltage v ddd =3v; i oh = ? 4ma v ddd ? 0.4 - v ddd v v ol low-level output voltage v ddd =3v; i ol =4ma v ssd -v ssd +0.4 v i oh high-level output current v ddd = 3 v; v oh = v ddd ? 0.3 ? 4-- ma i ol low-level output current v ddd = 3 v; v ol = v ddd -0.3 4-- ma
pr5331c3hn_sds all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product short data sheet public rev. 3.0. ? 3 august 2011 206430 24 of 33 nxp semiconductors pr5331c3hn contactless interface controller 10.20 output pin charact eristics for tx1/tx2 i li input leakage current rstpd_n = 0 v ? 1-+1 ? a c i input capacitance - 2.5 - pf c l load capacitance - - 15 pf table 30. output pin characteristics for aux1/aux2 ?continued symbol parameter conditions min typ max unit table 31. output pin characteristics for tx1/tx2 symbol parameter conditions min typ max unit v oh high-level output voltage v dd(tvdd) = 3 v; i o = 32 ma; cwgsn = fh - - 150 mv v dd(tvdd) = 3 v; i o = 80 ma; cwgsn = fh - - 400 mv v ol low-level output voltage v dd(tvdd) = 2.5 v; i o = 32 ma; cwgsn = fh - - 240 mv v dd(tvdd) = 2.5 v; i o = 80 ma; cwgsn = fh - - 640 mv table 32. output resistance for tx1/tx2 symbol parameter conditions1 cwgsp min typ max unit r oh high-level output resistance v dd(tvdd) = 3 v; v o = v dd(tvdd) ? 100 mv 01h 133 180 251 ? 02h 67 90 125 ? 04h 34 46 62 ? 08h 17 23 31 ? 10h 8.5 12 15.5 ? 20h 4.7 6 7.8 ? 3fh 2.3 3 4.4 ? r ol low-level output resistance 10h 34 46 62 ? 20h 17 23 31 ? 40h 8.5 12 15.5 ? 80h 4.7 6 7.8 ? f0h 2.3 3 4.4 ?
pr5331c3hn_sds all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product short data sheet public rev. 3.0. ? 3 august 2011 206430 25 of 33 nxp semiconductors pr5331c3hn contactless interface controller 10.21 system reset timing [1] dependent on the 27.12 mhz crysta l oscillator startup time. [2] if the t rst pulse is shorter than 20 ns, t he device may be only partially reset. fig 5. system reset overview t w(rst) t rst v th(rst)reg + v th(rst)reg(hys) v th(rst)reg(hys) v dd(pvdd) rstpd_n rstout_n t por 001aao394 table 33. reset duration time symbol parameter conditions min typ max unit t por power-on reset time [1] 0.1 0.4 2 ms t rst reset time hard power-down time; user dependent [2] 20 - - ns t w(rst) reset pulse width reset time when rstpd_n is released [1] 0.1 0.4 2 ms
pr5331c3hn_sds all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product short data sheet public rev. 3.0. ? 3 august 2011 206430 26 of 33 nxp semiconductors pr5331c3hn contactless interface controller 10.22 timing for the i 2 c-bus interface [1] the pr533 has a slope control according to the i 2 c-bus specification for the fast mode. the slope control is always present and not dependent of the i 2 c-bus speed. [2] 27.12 mhz quartz starts in less than 800 ? s. for example, quartz like tas-3225a, tas-7 or kss2f with appropriate layout. [3] the pr533 has an internal hold time of around 270ns fo r the sda signal to bridge the undefined region of the falling edge of p50_scl. 10.23 temperature sensor [1] the temperature sensor embedded in the pr533 is not intended to monitor the temperature. its purpose is to prevent destruction of the ic due to excessive heat. the external appl ication should include circuitry to ensure that the ambient temperature does not exceed 85 ? c as specified in table 5 ? operating conditions ? . table 34. i 2 c-bus timing specification symbol parameter conditions min typ max unit f scl scl clock frequency 0 - 400 khz t hd;sta hold time (repeated) start condition after this period, the first clock pulse is generated 600 - - ns t su;sta set-up time for a repeated start condition 600 - - ns t su;sto set-up time for stop condition 600 - - ns t low low period of the scl clock p50_scl 1300 - - ns t high high period of the scl clock p50_scl 600 - - ns t hd;dat data hold time 0 - 900 ns t su;dat data set-up time 100 - - ns t r rise time of both sda and scl signals p50_scl [1] 20 - 300 ns t f fall time of both sda and scl signals p50_scl [1] 20 - 300 ns t buf bus free time between a stop and start condition 1.3 - - ms t stretch stretch time stretching time on p50_scl when woken-up on its own address [2] --1ms t h hold time internal for sda 330 - 590 ns internal for sda in spd mode [3] -270-ns table 35. temperature sensor characteristics symbol parameter conditions min typ max unit t th(act)otp overtemperatur e protection activation threshold temperature ciu [1] 100 125 140 ?c
pr5331c3hn_sds all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product short data sheet public rev. 3.0. ? 3 august 2011 206430 27 of 33 nxp semiconductors pr5331c3hn contactless interface controller 11. application information 12. abbreviations fig 6. application diagram of pr533 aaa-000042 r scl r 1 l 0 l 0 c 1 c 1 c 0 c 2 c 0 c 2 r q r q r 2 c rx antenna c vmid interface supply supply r sda l 2 c memory secure core sda svdd sigout sigin tvdd p70_irq rtspd_n pvdd dvdd vbus host - processor host interface avdd oscin oscout avss dvss 27.12 mhz p34 rx vmid pr533 tx1 tvss1 tvss2 tx2 p50_scl table 36. abbreviations acronym description cdm charge device body model crc cyclic redundancy check eeprom electrically erasable programmable read-only memory hbm human body model hpd hard power down mm machine model nfc near field communication spd soft power down mode
pr5331c3hn_sds all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product short data sheet public rev. 3.0. ? 3 august 2011 206430 28 of 33 nxp semiconductors pr5331c3hn contactless interface controller 13. revision history table 37. revision history document id release date data sheet status change notice supersedes pr5331c3hn_sds v.3.0 20110803 product short data sheet - -
pr5331c3hn_sds all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product short data sheet public rev. 3.0. ? 3 august 2011 206430 29 of 33 nxp semiconductors pr5331c3hn contactless interface controller 14. legal information 14.1 data sheet status [1] please consult the most recently issued document before initiating or completing a design. [2] the term ?short data sheet? is explained in section ?definitions?. [3] the product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple device s. the latest product status information is available on the internet at url http://www.nxp.com . 14.2 definitions draft ? the document is a draft versi on only. the content is still under internal review and subject to formal approval, which may result in modifications or additions. nxp semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall hav e no liability for the consequences of use of such information. short data sheet ? a short data sheet is an extract from a full data sheet with the same product type number(s) and title. a short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. for detailed and full information see the relevant full data sheet, which is available on request vi a the local nxp semiconductors sales office. in case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. product specification ? the information and data provided in a product data sheet shall define the specification of the product as agreed between nxp semiconductors and its customer , unless nxp semiconductors and customer have explicitly agreed otherwis e in writing. in no event however, shall an agreement be valid in which the nxp semiconductors product is deemed to offer functions and qualities beyond those described in the product data sheet. 14.3 disclaimers limited warranty and liability ? information in this document is believed to be accurate and reliable. however, nxp semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. in no event shall nxp semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. notwithstanding any damages that customer might incur for any reason whatsoever, nxp semiconductors? aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the terms and conditions of commercial sale of nxp semiconductors. right to make changes ? nxp semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. this document supersedes and replaces all information supplied prior to the publication hereof. suitability for use ? nxp semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an nxp semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. nxp semiconductors accepts no liability for inclusion and/or use of nxp semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer?s own risk. applications ? applications that are described herein for any of these products are for illustrative purpos es only. nxp semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. customers are responsible for the design and operation of their applications and products using nxp semiconductors products, and nxp semiconductors accepts no liability for any assistance with applications or customer product design. it is customer?s sole responsibility to determine whether the nxp semiconductors product is suitable and fit for the customer?s applications and products planned, as well as fo r the planned application and use of customer?s third party customer(s). customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. nxp semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer?s applications or products, or the application or use by customer?s third party customer(s). customer is responsible for doing all necessary testing for the customer?s applic ations and products using nxp semiconductors products in order to av oid a default of the applications and the products or of the application or use by customer?s third party customer(s). nxp does not accept any liability in this respect. limiting values ? stress above one or more limiting values (as defined in the absolute maximum ratings system of iec 60134) will cause permanent damage to the device. limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the recommended operating conditions section (if present) or the characteristics sections of this document is not warranted. constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. terms and conditions of commercial sale ? nxp semiconductors products are sold subject to the gener al terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms , unless otherwise agreed in a valid written individual agreement. in case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. nxp semiconductors hereby expressly objects to applying the customer?s general terms and conditions with regard to the purchase of nxp semiconducto rs products by customer. no offer to sell or license ? nothing in this document may be interpreted or construed as an offer to sell products t hat is open for acceptance or the grant, conveyance or implication of any lic ense under any copyrights, patents or other industrial or intellectual property rights. export control ? this document as well as the item(s) described herein may be subject to export control regulations. export might require a prior authorization from national authorities. document status [1] [2] product status [3] definition objective [short] data sheet development this document contains data from the objecti ve specification for product development. preliminary [short] data sheet qualification this document contains data from the preliminary specification. product [short] data sheet production this document contains the product specification.
pr5331c3hn_sds all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product short data sheet public rev. 3.0. ? 3 august 2011 206430 30 of 33 nxp semiconductors pr5331c3hn contactless interface controller quick reference data ? the quick reference data is an extract of the product data given in the limiting values and characteristics sections of this document, and as such is not comple te, exhaustive or legally binding. non-automotive qualified products ? unless this data sheet expressly states that this specific nxp semicon ductors product is automotive qualified, the product is not suitable for automotive use. it is neither qualified nor tested in accordance with automotive testing or application requirements. nxp semiconductors accepts no liabili ty for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. in the event that customer uses t he product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without nxp semiconductors? warranty of the product for such automotive applicat ions, use and specifications, and (b) whenever customer uses the product for automotive applications beyond nxp semiconductors? specifications such use shall be solely at customer?s own risk, and (c) customer fully in demnifies nxp semi conductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive appl ications beyond nxp semiconductors? standard warranty and nxp semicond uctors? product specifications. 14.4 licenses 14.5 trademarks notice: all referenced brands, produc t names, service names and trademarks are the property of their respective owners. mifare ? is a trademark of nxp b.v. i 2 c-bus ? logo is a trademark of nxp b.v. 15. contact information for more information, please visit: http://www.nxp.com for sales office addresses, please send an email to: salesaddresses@nxp.com purchase of nxp ics with iso/iec 14443 type b functionality this nxp semiconductors ic is iso/iec 14443 type b software enabled and is licensed under innovatron?s contactless card patents license for iso/iec 14443 b. the license includes the right to use the ic in systems and/or end-user equipment. ratp/innovatron technology purchase of nxp ics with nfc technology purchase of an nxp semiconductors ic that complies with one of the near field communication (nfc) standards iso/iec 18092 and iso/iec 21481 does not convey an implied license unde r any patent right infringed by implementation of any of those standards. a license for the patents portfolio of nxp b.v. for the nfc standards needs to be obtained at via licensing, the pool agent of the nfc patent pool, e-mail: info@vialicensing.com .
pr5331c3hn_sds all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product short data sheet public rev. 3.0. ? 3 august 2011 206430 31 of 33 nxp semiconductors pr5331c3hn contactless interface controller 16. tables table 1. quick reference data . . . . . . . . . . . . . . . . . . . . .3 table 2. ordering information . . . . . . . . . . . . . . . . . . . . .3 table 3. pr533 pin description . . . . . . . . . . . . . . . . . . . .5 table 4. limiting values . . . . . . . . . . . . . . . . . . . . . . . . . .7 table 5. operating conditions . . . . . . . . . . . . . . . . . . . . .7 table 6. thermal characteristics . . . . . . . . . . . . . . . . . . .8 table 7. current consumption characteristics . . . . . . . . .9 table 8. voltage regulator characteristics [1] . . . . . . . . . . .9 table 9. antenna presence detection . . . . . . . . . . . . . . .10 table 10. crystal requirements. . . . . . . . . . . . . . . . . . . . . 11 table 11. pin characteristics for 27.12 mhz xtal oscillator (oscin, oscout). . . . . . . . . . . . . . 11 table 12. rstpd_n input pin characteristics . . . . . . . . .12 table 13. input pin characteristics for i0, i1 and testen . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12 table 14. rstout_n output pin characteristics . . . . . . .13 table 15. input/output pin characteristics for pin p70_irq . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14 table 16. input/output pin characteristics for p30 / uart_rx, p31 / uart_tx, p32_int0, p33_int1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15 table 17. input/output pin characteristics for p35 . . . . . .16 table 18. input/output pin characteristics for dp and dm for usb interface . . . . . . . . . . . . . . . . . . . .17 table 19. usb dp/dm differential receiver input levels . .18 table 20. usb dp/dm driver characteristics . . . . . . . . . .18 table 21. input pin characteristics for dp for hsu interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19 table 22. output pin characteristics for dm for hsu interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19 table 23. input/output drai n output pin characteristics for sda/p50_slc i 2 c interface . . . . . . . . . . . .20 table 24. output pin characteristics for delatt . . . . . . .20 table 25. input/output pin characteristics for sigin . . . . .20 table 26. output pin characteri stics for sigout . . . . . . .21 table 27. input/output pin characteristics for p34 . . . . . .22 table 28. output pin characteristics for loadmod . . . .22 table 29. input pin characteristics for rx . . . . . . . . . . . .23 table 30. output pin characteristics for aux1/aux2 . . .23 table 31. output pin characteristics for tx1/tx2. . . . . . .24 table 32. output resistance for tx1/tx2 . . . . . . . . . . . . .24 table 33. reset duration time . . . . . . . . . . . . . . . . . . . . .25 table 34. i 2 c-bus timing specification . . . . . . . . . . . . . . .26 table 35. temperature sensor characteristics . . . . . . . . .26 table 36. abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . .27 table 37. revision history . . . . . . . . . . . . . . . . . . . . . . . .28
pr5331c3hn_sds all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product short data sheet public rev. 3.0. ? 3 august 2011 206430 32 of 33 nxp semiconductors pr5331c3hn contactless interface controller 17. figures fig 1. block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . .4 fig 2. pin configuration for hvqfn 40 (sot618-1) . . . .5 fig 3. 27.12 mhz input clock phase noise spectrum mask . . . . . . . . . . . . . . . . . . . . . . . . . . 11 fig 4. transmit waveform at dp/dm . . . . . . . . . . . . . . .18 fig 5. system reset overview. . . . . . . . . . . . . . . . . . . . .25 fig 6. application diagram of pr533 . . . . . . . . . . . . . . .27
nxp semiconductors pr5331c3hn contactless interface controller ? nxp b.v. 2011. all rights reserved. for more information, please visit: http://www.nxp.com for sales office addresses, please se nd an email to: salesaddresses@nxp.com date of release: 3 august 2011 206430 please be aware that important notices concerning this document and the product(s) described herein, have been included in section ?legal information?. 18. contents 1 general description . . . . . . . . . . . . . . . . . . . . . . 1 1.1 rf protocols . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.2 interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.3 standards compliancy. . . . . . . . . . . . . . . . . . . . 1 1.4 supported operating systems . . . . . . . . . . . . . . 2 2 features and benefits . . . . . . . . . . . . . . . . . . . . 2 3 quick reference data . . . . . . . . . . . . . . . . . . . . . 3 4 ordering information . . . . . . . . . . . . . . . . . . . . . 3 5 block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 4 6 pinning information . . . . . . . . . . . . . . . . . . . . . . 5 6.1 pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 6.2 pin description . . . . . . . . . . . . . . . . . . . . . . . . . 5 7 limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 7 8 recommended operating conditions. . . . . . . . 7 9 thermal characteristics . . . . . . . . . . . . . . . . . . 8 10 characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 9 10.1 power management characteristics . . . . . . . . . 9 10.1.1 current consumption characteristics . . . . . . . . 9 10.1.2 voltage regulator characteristics. . . . . . . . . . . . 9 10.2 antenna presence self test thresholds . . . . . . 10 10.3 typical 27.12 mhz crystal requirements . . . . 11 10.4 pin characteristics for 27.12 mhz xtal oscillator (oscin, oscout). . . . . . . . . . . . . 11 10.5 rstpd_n input pin characteristics . . . . . . . . 12 10.6 input pin characteristics for i0, i1 and testen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 10.7 rstout_n output pin characteristics . . . . . . 13 10.8 input/output characteristics for pin p70_irq . 14 10.9 input/output pin characteristics for p30 / uart_rx, p31 / uart_tx, p32_int0, p33_int1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 10.10 input/output pin characteristics for p35 . . . . . 16 10.11 input/output pin characteristics for dp and dm . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 10.12 input pin characteristics for sda/p50_slc . . 20 10.13 output pin characteristics for delatt . . . . . . 20 10.14 input pin characteristics for sigin . . . . . . . . . 20 10.15 output pin characteristics for sigout . . . . . . 21 10.16 input/output pin characteristics for p34 . . . . . 22 10.17 output pin characteristics for loadmod. . . . 22 10.18 input pin characteristics for rx. . . . . . . . . . . . 23 10.19 output pin characteristics for aux1/aux2 . . . 23 10.20 output pin characteristics for tx1/tx2. . . . . . 24 10.21 system reset timing . . . . . . . . . . . . . . . . . . . . 25 10.22 timing for the i 2 c-bus interface . . . . . . . . . . . 26 10.23 temperature sensor . . . . . . . . . . . . . . . . . . . . 26 11 application information . . . . . . . . . . . . . . . . . 27 12 abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . 27 13 revision history . . . . . . . . . . . . . . . . . . . . . . . 28 14 legal information . . . . . . . . . . . . . . . . . . . . . . 29 14.1 data sheet status . . . . . . . . . . . . . . . . . . . . . . 29 14.2 definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 14.3 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . 29 14.4 licenses. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 14.5 trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . 30 15 contact information . . . . . . . . . . . . . . . . . . . . 30 16 tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 17 figures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 18 contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33

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